System Design :	Telecom, Datacom, Control systems, Display systems, Mobile applications, Semiconductor, Industrial and Consumer products.
Board Design :	Size : 320 mm x 200 mm No of layers : 20 layers No of components: 4000 + 10 BGA devices Nets : >18K
Processor :	ARM 9, ARM 11, ARM Cortex, PowerPC, x86, strongARM, OMAP, C51, Mcirochip, Renesas, TI
Soft-Processor :	LatticeMICO 32, NIOS-II
FPGA :	Lattice, Xlinix, Altera and Actel Languages : Verilog and VHDL Verification : Modelsim Interface : Wishbone AHB/APB etc
Interfaces :	Communication & Buses UART, IrDA, I2C, I2S, USB (1.1 and 2.0 HighSpeed), IEEE1394, Bluetooth, IR, Legacy Peripherals and Custom interfaces for devices like RFID Reader/Writer, IR Keyboard etc. PCI (32b/64b@33/66MHz), PCI-X, cPCI, VME, IDE, SCSI, iSCSI, PCMCIA, SDIO CCIR601, CCIR65 High Speed Communication Interfaces GMII, XGMII, XAUI, POS-PHY Level3, POS-PHY Level4, SPI-4, SFI-4 Networking/Communication Interfaces SONET/SDH, POS, GbE, 10GbE E1/T1, E3/T3, RS-485 Memory Device Interfaces Flash, SDRAM, DDR-SDRAM, DDR2, DDR3 DiskOnChip, CompactFlash, NAND Flash
Software :	Bootloaders BSP's OS: Embedded Linux, uCLinux, WinCE, Android and proprietary kernels Device Drivers : Communication devices, display devices, network devices, storage devices, I/O devices, multimedia devices etc Protocol stacks : Microcontroller based software Diagnostics OST, prototype debugging and production/manufacturing diagnostics Application Software : such as web based, management etc Languages : Assembly, C, C++, .Net VB/#C/ASP, html, XML, JAVA,PHP etc Servers : APACHE, TOMCAT, IIS Datebase : MQ-SQL, MS-Access, SQL
Testing :	Functional and timing Design validation Agency Certification Support during Alpha and Beta Testing and deployment

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